Bedrock V3000 Basic
SolidRun Bedrock V3000 Basic – Compact Fanless Industrial PC with AMD Ryzen™ Embedded V3000
High-Performance, Rugged, and Built for Demanding Industrial Applications
The Bedrock V3000 Basic from SolidRun, is a compact fanless industrial PC built for demanding edge computing, networking, and industrial workloads. Powered by the AMD Ryzen™ Embedded V3C48 processor with 8 cores and 16 threads, this rugged system combines exceptional compute performance, wide temperature tolerance, and state-of-the-art connectivity — all in a durable enclosure under 1 liter in volume.
Key Features
- AMD Ryzen™ Embedded V3C48 (8C/16T, up to 5.1 GHz, 6nm process)
- Up to 64 GB DDR5 ECC memory
- 3x NVMe Gen4 2280 storage slots
- Dual 10 GbE SFP+ + 4x 2.5 GbE (copper or fiber)
- Wi-Fi 6E, 5G modem with dual SIM
- Fanless passive cooling, dust-resistant IP40-rated aluminium chassis
- Operates in -40°C to +85°C industrial temperature range
- Compact DIN-rail and wall-mountable design with 12V–60V DC input
Exceptional Embedded Performance
The Ryzen Embedded V3000 series brings next-generation performance and efficiency to industrial-grade PCs. With 20 PCIe Gen4 lanes, the CPU enables fast communication with NVMe storage, network interfaces, and I/O devices — ideal for:
- Industrial automation
- Edge networking
- Real-time analytics
- Secure IoT gateways
Advanced Fanless Cooling for Harsh Environments
- The Bedrock V3000 Basic features a highly efficient passive cooling system:
- Liquid metal TIM for direct CPU-to-chassis heat transfer
- Stacked heatpipes for 360° thermal distribution
- Dual-layer convection-boosted chassis walls
- All heat-generating components (CPU, NVMe, memory, NICs, modems) are thermally coupled to the chassis, ensuring stable 24/7 performance even under full load.
Comprehensive I/O and Connectivity
Despite its small form factor, Bedrock V3000 Basic delivers exceptional I/O:
- 2x 10 GbE SFP+ ports + 4x 2.5 GbE ports
- Wi-Fi 6E, 5G modem support with dual SIM
- 4x USB ports, console port, remote power button
- All front-facing for easy access and integration
Modular and Customizable Architecture
The Bedrock series is designed for flexibility:
- SoM (System on Module): CPU, DDR5 RAM, NVMe, all native interfaces
- NIO Board: Networking and I/O
- SX Board: Wi-Fi, 5G modem, additional storage
- Power Module (PM): Wide-range DC input with dual-stage regulation
You can mix-and-match modules to tailor your system. Custom boards for OEM/ODM are also supported.
Built for Industrial Reliability
- ECC memory support
- NVMe with power-loss protection (PLP) available
- Redundant SPI Flash, watchdog timer (WDT), and TPM
- Fanless, ventless enclosure = no maintenance required
- 10-year lifecycle availability
Also Available: Bedrock Tile and Deck for Tight Spaces
- Bedrock Tile: Ultra-slim 0.6L version with conduction cooling and 29mm thickness
- Bedrock Deck: Modular core for integration into custom enclosures, with thermal coupling built-in
Datasheet: Bedrock V3000 Basic
Additional information
Contact us: | Email: [email protected] |
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Design | Aluminium, Compact, Fanless |
Operating Systems | Linux, Windows, Windows IoT |
Processor | AMD Ryzen™ / Embedded |
Temperature | -40°C to 85°C |
Get a quote

Kevin Peter Gade
Sales Manager
Telefon: +45 7027 0415
Email: [email protected]